Electronic materials and processes handbook
I tiakina i:
| Kaituhi matua: | |
|---|---|
| Hōputu: | Pukapuka |
| Reo: | Ingarihi |
| I whakaputaina: |
Nueva York
McGraw Hill
1994
|
| Putanga: | 2a. ed |
| Rangatū: | Electronic Packaging and Interconnection Series
|
| Ngā marau: | |
| Ngā Tūtohu: |
Tāpirihia he Tūtohu
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
|
Me noho koe te mea tuatahi ki te waiho tākupu!